Assignment of Assignor's Interest

Recorded: 2004-09-29 Pages: 4

Assignors

TOWNSEND, III, PAUL H.

Executed: 2003-05-15

MILLS, LYNNE K.

Executed: 2003-05-15

STRITTMATTER, RICHARD J.

Executed: 2003-05-29

Assignee

DOW GLOBAL TECHNOLOGIES INC.

WASHINGTON STREET, 1790 BUILDING, MIDLAND, MICHIGAN, 48674

Covered Properties (2)

Tri-layer masking architecture for patterning dual damascene interconnects

Application: 60/369,489 →

Method of integrating a porous dielectric in an integrated circuit device

Application: 60/369,490 →

Related Assignments (1)

Other recorded transfers of the patents in this record — the chain of ownership.