IP Library › Patent Application 60369489
Patent Application Provisional
App. No. 60/369,489 · Confirmation No. 6219

Tri-layer masking architecture for patterning dual damascene interconnects

Provisional Application Expired
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 Code Description Pages PDF
2002-04-02 TRNA Transmittal of New Application 1 View
2002-04-02 SPEC Specification 19 View
2002-04-02 CLM Claims 7 View
2002-04-02 ABST Abstract 1 View
2002-04-02 DRW Drawings-only black and white line drawings 12 View
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Quick Facts
App. No.
60/369,489
Filed
2002-04-02