IP Library Assignment 015197/0908
Patent Assignment
Reel/Frame 015197/0908

Assignment of Assignor's Interest

Recorded: 2004-09-29 Pages: 4
Assignor
WAETERLOOS, JOOST J. M.
Executed: 2003-05-08
Assignee
DOW BELGIUM B.V.B.A.
HAVENLAAN 7, TESSENDERLO, 3980, BELGIUM
Covered Properties (2)
Tri-layer masking architecture for patterning dual damascene interconnects
Application: 60/369,489 →
Method of integrating a porous dielectric in an integrated circuit device
Application: 60/369,490 →
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 29, 2004
From: TOWNSEND, III, PAUL H.; MILLS, LYNNE K.; STRITTMATTER, RICHARD J.
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 015197/0822 →