Patent Assignment
Reel/Frame 015244/0974
Assignment of Assignor's Interest
Recorded: 2004-10-13
Pages: 4
Assignors
KWON, YONG-HWAN
Executed: 2004-07-16
KANG, SA-YOON
Executed: 2004-07-15
LEE, CHUNG-SUN
Executed: 2004-07-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Redistribution Bump and Semiconductor Chip and Mount Structure Fabricated Using the Same