Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same
Provided are a method of forming a bump whose upper surface is substantially flat and whose area can be enlarged in a uniform pad pitch to simplify mounting a liquid crystal display drive IC (LDI) and a semiconductor chip and a mount structure using the method to minimize a pad area inside the chip. Thus, the pad area on an edge of a conventional chip is minimized and the bump is formed in a substantially flat location inside the chip and an electrical connection between the pad and the bump is performed by a redistribution metal line.
1. A method of forming a semiconductor device, the method comprising:
preparing a wafer-state chip having a pad formed thereon;
forming a first passivation film overlying the chip, the first passivation film partially exposing an upper portion of the pad;
forming a second passivation film to expose the upper portion of the pad and a portion of the first passivation film;
forming a redistribution metal layer on the second passivation film, the redistribution metal layer having a substantially flat surface;
forming a bump on the substantially flat surface spaced apart from the pad and then etching a portion of the redistribution metal layer to form a metal line extending under the bump; and
forming a third passivation film protecting the redistribution metal line and exposing the bump.
2. The method of claim 1 , wherein forming the bump comprises:
forming a first photoresist pattern on the redistribution metal line,
wherein the first photoresist pattern has an opening on the upper portion of the second passivation film in the substantially flat location detached from the location of the pad;
forming the bump by filling the opening with metal; and
removing the first photoresist pattern.
3. The method of claim 1 , wherein forming the bump and etching the redistribution metal layer comprise:
forming a first photoresist pattern on the redistribution metal line,
wherein the first photoresist pattern has an opening on the upper portion of the second passivation film in the substantially flat location detached from the location of the pad;
forming the bump by filling the opening with metal;
forming a second photoresist pattern covering the pad and the bump by exposing and developing the first photoresist pattern;
etching a portion of the redistribution metal layer, using the second photoresist pattern as an etching mask; and
removing the second photoresist pattern.
4. The method of claim 1 , wherein forming the bump and etching the redistribution metal layer comprise:
forming a first photoresist pattern on the redistribution metal layer,
wherein the first photoresist pattern has an opening on the upper portion of the second passivation film in the substantially flat location detached from the location of the pad;
forming the bump inside the opening;
removing the first photoresist pattern;
forming a second photoresist pattern covering the pad and the bump;
etching a portion of the redistribution metal layer, using the second photoresist pattern as an etching mask; and
removing the second photoresist pattern.
5. The method of claim 1 , wherein the redistribution metal layer is made using one of evaporation, sputtering, and plating.
6. The method of claim 1 , wherein the redistribution metal layer is made of one selected form the group consisting of TiW, Au, Cr, Cu, Ti, Ni, Niv, Pd, and a compound line made of at least two of TiW, Au, Cr, Cu, Ti, Ni, NiV, Pd.
7. The method of claim 1 , wherein the bump is made of one of gold and a gold alloy.
8. The method of claim 1 , wherein the redistribution metal line and bump have an additional redistribution metal line formed therebetween.
9. The method of claim 8 , wherein the additional redistribution metal line is made of one selected from the group consisting of Au, an Au alloy, and a Ni/Au.
10. A method of forming a semiconductor device, the method comprising:
preparing a wafer-state chip having a pad formed thereon;
forming a first passivation film overlying the chip, the first passivation film partially exposing an upper portion of the pad.
forming a second passivation film to expose the upper portion of the pad and a portion of the first passivation film;
forming a redistribution metal layer on the second passivation film, the redistribution metal layer having a substantially flat surface;
forming a first photoresist pattern on the redistribution metal layer, wherein the first photoresist pattern has an opening on the upper portion of the second passivation film in the substantially flat location detached from the location of the pad;
forming a bump on the substantially flat surface spaced apart from the pad by filling the opening With metal;
etching a portion of the redistribution metal layer using the second photoresist pattern as an etching mask to form a metal line extending under the bump;
forming a second photoresist pattern covering the pad and the bump by exposing and developing the first photoresist pattern;
removing the second photoresist pattern; and
forming a third passivation film protecting the redistribution metal line and exposing the bump.
11. A method of forming a semiconductor device, the method comprising:
preparing a wafer-state chip having a pad formed thereon;
forming a first passivation film overlying the chip, the first passivation film partially exposing an upperportion of the pad;
forming a second passivation film to expose the upper portion of the pad and a portion of the first passivation film;
forming a redistribution metal layer on the second passivation film, the redistribution metal layer having a substantially flat surface;
forming a first photoresist pattern on the redistribution metal layer, wherein the first photoresist pattern has an opening on the upper portion of the second passivation film in the substantially flat location detached from the location of the pad;
forming a bump on the substantially flat surface spaced apart from the pad inside the opening.
removing the first photoresist pattern;
forming a second photoresist pattern covering the pad and the bump;
etching a portion of the redistribution metal layer, using the second photoresist pattern as an etching mask to form a metal line extending under the bump;
removing the second photoresist pattern; and
forming a third passivation film protecting the redistribution metal line and exposing the bump.