Patent Assignment
Reel/Frame 015372/0534
Correct Inventor [1] Name
Recorded: 2004-11-12
Pages: 7
Assignors
HABERERN, KEVIN WARD
Executed: 2004-02-12
ROSADO, RAYMOND
Executed: 2004-03-26
BERGMAN, MICHAEL JOHN
Executed: 2004-02-06
EMERSON, DAVID TODD
Executed: 2004-02-06
Assignee
CREE, INC.
4600 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Property
(1)
Methods of Forming Semiconductor Devices Including Mesa Structures and Multiple Passivation Layers
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 14, 2004
From: HAERERN, KEVIN WARD; ROSADO, RAYMOND; BERGMAN, MICHAEL JOHN; EMERSON, DAVID TODD
To: CREE, INC.
Reel/Frame 015204/0491 →
Assignment of Assignor's Interest
Apr 1, 2021
From: CREE, INC.
To: CREE LED, INC.
Reel/Frame 056012/0200 →
Security Interest
Feb 7, 2022
From: SMART MODULAR TECHNOLOGIES, INC.; SMART HIGH RELIABILITY SOLUTIONS, LLC; SMART EMBEDDED COMPUTING, INC.; CREELED, INC.
To: CITIZENS BANK, N.A.
Reel/Frame 058983/0001 →
Release of Patent Security Interest Recorded at R/F 058983/0001
Jun 25, 2025
From: CITIZENS BANK, N.A.
To: SMART MODULAR TECHNOLOGIES, INC.; SMART EMBEDDED COMPUTING, INC.; SMART HIGH RELIABILITY SOLUTIONS LLC; CREELED, INC.
Reel/Frame 071725/0207 →
Corrective Assignment to Correct the Name of the Assignee Previously Recorded on Reel 56012 Frame 200. Assignor(S) Hereby Confirms the Assignment.
Jul 9, 2025
From: CREE, INC.
To: CREELED, INC.
Reel/Frame 071874/0001 →