Patent Assignment
Reel/Frame 015391/0211
Assignment of Assignor's Interest
Recorded: 2004-11-23
Pages: 3
Assignors
ADKISSON, JAMES W.
Executed: 2004-11-19
GAMBINO, JEFFREY P.
Executed: 2004-11-22
JAFFE, MARK D.
Executed: 2004-11-18
RASSEL, RICHARD J.
Executed: 2004-11-19
SPROGIS, EDMUND J.
Executed: 2004-11-18
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
High Surface Area Aluminum Bond Pad for Through-Wafer Connections to an Electronic Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.