Patent Assignment
Reel/Frame 033122/0154
Assignment of Assignor's Interest
Recorded: 2014-06-17
Pages: 8
Assignor
INTERNATIONAL BUSINESS MACHINES CORPORATION
Executed: 2013-08-05
Assignee
ULTRATECH, INC.
3050 ZANKER ROAD, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(11)
Metallization Composite Having Nickel Intermediate/Interface
Patent:
5,719,070 →
Application:
08/720,852 →
Copper Pad Structure
Selective Filling of Electrically Conductive Vias for Three Dimensional Device Structures
Improvements in Grounding and Thermal Dissipation for Integrated Circuit Packages
High Surface Area Aluminum Bond Pad for Through-Wafer Connections to an Electronic Package
Undercut-Free Blm Process for Pb-Free and Pb-Reduced C4
Undercut-Free Blm Process for Pb-Free and Pb-Reduced C4
Structures and Methods to Improve Lead-Free C4 Interconnect Reliability
Overcoming Laminate Warpage and Misalignment in Flip-Chip Packages
Localized Temperature Control During Rapid Thermal Anneal
Semiconductor Wafer Processing Method That Allows Device Regions to Be Selectively Annealed Following Back End of the Line (Beol) Metal Wiring Layer Formation
Patent:
8,021,950 →
Application:
12/911,940 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 18, 2010
From: GRAF, RICHARD S.; LOMBARDI, THOMAS E.; RAY, SUDIPTA K.; WEST, DAVID J.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 023952/0125 →
Assignment of Assignor's Interest
Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051446/0476 →
Patent Security Agreement
Dec 16, 2021
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 058533/0321 →
Security Interest
Jun 16, 2025
From: VEECO INSTRUMENTS INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 071649/0225 →