IP Library › Assignment 015443/0199
Patent Assignment
Reel/Frame 015443/0199

Assignment of Assignor's Interest

Recorded: 2004-06-08 Pages: 3
Assignors
KISHIMOTO, DAISUKE
Executed: 2004-04-14
IWAMOTO, SUSUMU
Executed: 2004-04-14
UENO, KATSUNORI
Executed: 2004-04-15
SHIMIZU, RYOSUKE
Executed: 2004-04-13
OKA, SATOSHI
Executed: 2004-04-14
Assignees
FUJI ELECTRIC HOLDINGS CO., LTD.
1-11-2 OSAKI, SHINAGAWA-KU, TOKYO, 141-0032, JAPAN
SHIN-ETSU HANDOTAI CO., LTD.
4-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-0005, JAPAN
Covered Property (1)
Fabrication Method of Semiconductor Wafer
Patent: 7,029,977 →
Application: 10/792,884 →
Publication: US 2004/0185665
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Aug 26, 2011
From: FUJI ELECTRIC HOLDINGS CO., LTD.
To: FUJI ELECTRIC CO., LTD.
Reel/Frame 026891/0655 →
Assignment of Assignor's Interest Mar 2, 2016
From: SHIN-ETSU HANDOTAI CO., LTD.
To: FUJI ELECTRIC CO., LTD.
Reel/Frame 037869/0097 →