IP Library Assignment 037869/0097
Patent Assignment
Reel/Frame 037869/0097

Assignment of Assignor's Interest

Recorded: 2016-03-02 Pages: 3
Assignor
SHIN-ETSU HANDOTAI CO., LTD.
Executed: 2015-10-29
Assignee
FUJI ELECTRIC CO., LTD.
1-1, TANABESHINDEN, KAWASAKI-KU, KAWASAKI-SHI, KANAGAWA, 210-9530, JAPAN
Covered Property (1)
Fabrication Method of Semiconductor Wafer
Patent: 7,029,977 →
Application: 10/792,884 →
Publication: US 2004/0185665
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 8, 2004
From: KISHIMOTO, DAISUKE; IWAMOTO, SUSUMU; UENO, KATSUNORI; SHIMIZU, RYOSUKE
To: FUJI ELECTRIC HOLDINGS CO., LTD.; SHIN-ETSU HANDOTAI CO., LTD.
Reel/Frame 015443/0199 →
Merger and Change of Name Aug 26, 2011
From: FUJI ELECTRIC HOLDINGS CO., LTD.
To: FUJI ELECTRIC CO., LTD.
Reel/Frame 026891/0655 →