Patent Assignment
Reel/Frame 015458/0173
Assignment of Assignor's Interest
Recorded: 2004-06-09
Pages: 4
Assignors
AKRAM, SAIMAN
Executed: 2004-06-03
BENSON, PETER A.
Executed: 2004-05-24
FAMWORTH, WARREN M.
Executed: 2004-05-27
HIATT, WILLIAM M.
Executed: 2004-06-02
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83716-9632
Covered Property
(1)
Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
Application:
10/863,994 →
Publication:
US 2005/0275750
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 27, 2009
From: MICRON TECHNOLOGY, INC.
To: APTINA IMAGING CORPORATION
Reel/Frame 022164/0794 →
Assignment of Assignor's Interest
Aug 31, 2009
From: APTINA IMAGING CORPORATION
To: MICRON TECHNOLOGY, INC.
Reel/Frame 023163/0322 →
Assignment of Assignor's Interest
Jan 4, 2010
From: MICRON TECHNOLOGY, INC.
To: ROUND ROCK RESEARCH, LLC
Reel/Frame 023786/0416 →