Patent Assignment
Reel/Frame 022164/0794
Assignment of Assignor's Interest
Recorded: 2009-01-27
Pages: 9
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2008-10-03
Assignee
APTINA IMAGING CORPORATION
C/O CITCO TRUSTEES (CAYMAN) LIMITED, REGATTA OFFICE PARK, WEST BAY ROAD, GRAND CAYMAN, Y1-1205, CAYMAN ISLANDS
Covered Property
(1)
Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
Application:
10/863,994 →
Publication:
US 2005/0275750
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 9, 2004
From: AKRAM, SAIMAN; BENSON, PETER A.; FAMWORTH, WARREN M.; HIATT, WILLIAM M.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 015458/0173 →
Assignment of Assignor's Interest
Aug 31, 2009
From: APTINA IMAGING CORPORATION
To: MICRON TECHNOLOGY, INC.
Reel/Frame 023163/0322 →
Assignment of Assignor's Interest
Jan 4, 2010
From: MICRON TECHNOLOGY, INC.
To: ROUND ROCK RESEARCH, LLC
Reel/Frame 023786/0416 →