IP Library › Assignment 015492/0997
Patent Assignment
Reel/Frame 015492/0997

Assignment of Assignor's Interest

Recorded: 2004-06-18 Pages: 3
Assignors
KOIKE, MASAHIRO
Executed: 2004-06-15
NARITA, HIROCHIKA
Executed: 2004-06-15
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Resin Molded Semiconductor Device
Patent: 7,265,444 →
Application: 10/870,023 →
Publication: US 2004/0262741
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 6, 2007
From: KOIKE, MASAHIRO; NARITA, HIROCHIKA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019426/0503 →
Change of Name Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0840 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →