Patent Assignment
Reel/Frame 015518/0208
Assignment of Assignor's Interest
Recorded: 2004-01-09
Pages: 3
Assignors
SHIONO, OSAMU
Executed: 2003-12-07
ISHIKAWA, TAKAO
Executed: 2003-12-02
NAMEKAWA, TAKASHI
Executed: 2003-11-26
SUZUKI, YASUTAKA
Executed: 2003-12-13
NAITO, TAKASHI
Executed: 2003-11-26
YAMAMOTO, HIROKI
Executed: 2003-11-26
KAMOTO, DAIGORO
Executed: 2003-12-03
TAKAHASHI, KEN
Executed: 2003-12-05
SEGAWA, TADANORI
Executed: 2003-12-15
SATO, TOSHIYA
Executed: 2003-11-26
MIWA, TAKAO
Executed: 2003-10-12
MOTOWAKI, SHIGEHISA
Executed: 2003-12-09
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO 101-8010, JAPAN
Covered Property
(1)
Wiring Glass Substrate for Connecting a Semiconductor Chip to a Printed Wiring Substrate and a Semiconductor Module Having the Wiring Glass Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.