Patent Assignment
Reel/Frame 018118/0680
Assignment of Assignor's Interest
Recorded: 2006-07-24
Pages: 3
Assignor
HITACHI, LTD.
Executed: 2006-06-27
Assignee
RENESAS TECHNOLOGY CORP.
MARUNOUCHI BLDG., 4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Wiring Glass Substrate for Connecting a Semiconductor Chip to a Printed Wiring Substrate and a Semiconductor Module Having the Wiring Glass Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.