IP Library › Assignment 015619/0899
Patent Assignment
Reel/Frame 015619/0899

Assignment of Assignor's Interest

Recorded: 2004-07-26 Pages: 3
Assignors
KARASAWA, TOSHIYUKI
Executed: 2004-06-30
OTSUKA, SATOSHI
Executed: 2004-06-10
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
Covered Property (1)
Multi-Layer Wiring Structure with Dummy Patterns for Improving Surface Flatness
Patent: 7,161,248 →
Application: 10/898,167 →
Publication: US 2005/0212136
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 9, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0089 →
Change of Name Jul 9, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024651/0744 →
Change of Address Dec 23, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 041188/0401 →