IP Library › Assignment 015702/0420
Patent Assignment
Reel/Frame 015702/0420

Assignment of Assignor's Interest

Recorded: 2004-08-13 Pages: 3
Assignors
CHEN, CHIEN-HUA
Executed: 2004-08-10
REBOA, PAUL F.
Executed: 2004-08-10
FOREST, TRACEY B.
Executed: 2004-08-10
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY, LP
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property (1)
System and Method for Low Temperature Plasma-Enhanced Bonding
Patent: 7,261,793 →
Application: 10/917,807 →
Publication: US 2006/0032582
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Re-Record to Correct the 3RD Inventors Name on a Document Previously Recorded at Reel 015702, Frame 0420. (Assignment of Assignor's Interest) Apr 18, 2005
From: CHEN, CHIEN-HUA; REBOA, PAUL F.; FORREST, TRACY B.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 016465/0849 →