IP Library › Assignment 016465/0849
Patent Assignment
Reel/Frame 016465/0849

Re-Record to Correct the 3RD Inventors Name on a Document Previously Recorded at Reel 015702, Frame 0420. (Assignment of Assignor's Interest)

Recorded: 2005-04-18 Pages: 4
Assignors
CHEN, CHIEN-HUA
Executed: 2004-08-10
REBOA, PAUL F.
Executed: 2004-08-10
FORREST, TRACY B.
Executed: 2004-08-10
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property (1)
System and Method for Low Temperature Plasma-Enhanced Bonding
Patent: 7,261,793 →
Application: 10/917,807 →
Publication: US 2006/0032582
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 13, 2004
From: CHEN, CHIEN-HUA; REBOA, PAUL F.; FOREST, TRACEY B.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP
Reel/Frame 015702/0420 →