Patent Assignment
Reel/Frame 015713/0671
Assignment of Assignor's Interest
Recorded: 2005-02-14
Pages: 3
Assignor
DONG, CHA DEOK
Executed: 2004-10-29
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-UEP, ICHON-SHI, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Polysilicon Layer in Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.