IP Library › Assignment 015728/0400
Patent Assignment
Reel/Frame 015728/0400

Assignment of Assignor's Interest

Recorded: 2004-08-24 Pages: 3
Assignors
LEE, TIN YUAN
Executed: 2004-08-10
LIN, ERIC
Executed: 2004-08-10
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN, CHINA
Covered Property (1)
Method for Fabricating Thermal Compliant Semiconductor Chip Wiring Structure for Chip Scale Packaging
Patent: 7,265,045 →
Application: 10/925,302 →
Publication: US 2005/0020052
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017566/0028 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →