Patent Assignment
Reel/Frame 015794/0591
Assignment of Assignor's Interest
Recorded: 2004-09-14
Pages: 2
Assignor
MURAKAMI, TAKEHIKO
Executed: 2004-09-01
Assignee
MINAMI CO., LTD.
38-32, MINAMIMACHI 5-CHOME, FUCHU-SHI, TOKYO, JAPAN
Covered Property
(1)
Method of Mounting Wafer on Printed Wiring Substrate