Patent Assignment
Reel/Frame 015887/0898
Assignment of Assignor's Interest
Recorded: 2004-10-11
Pages: 3
Assignors
MINAMITANI, SHOZO
Executed: 2004-09-17
MAE, TAKAHARU
Executed: 2004-09-22
UENO, YASUHARU
Executed: 2004-09-17
YAMADA, AKIRA
Executed: 2004-09-22
KANAYAMA, SHINJI
Executed: 2004-09-22
AKITA, MAKOTO
Executed: 2004-09-22
WATANABE, NOBUHISA
Executed: 2004-09-24
MORI, AKIRA
Executed: 2004-09-22
NAITO, HIYOYUKI
Executed: 2004-09-21
MARUMO, SHINYA
Executed: 2004-09-21
MORIKAWA, MAKOTO
Executed: 2004-09-17
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA, KADOMA-SHI, OSAKA 571-8501, JAPAN
Covered Property
(1)
Electronic Component Mounting Method and Apparatus and Ultrasondic Bonding Head
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.