Electronic component mounting method and apparatus and ultrasonic bonding head
A component mounting apparatus includes a component feeder ( 20 ) that feeds a component ( 2 ) with its bump electrodes facing down, a mounting head ( 5 ) that mounts the component onto a substrate ( 3 ), a supporting base ( 8 ) that secures the substrate, and a positioning device ( 6, 7 ) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator ( 24 ), an ultrasonic vibration propagation member ( 34, 38, 54 ) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face ( 33, 41, 57 ) holding the component as vibration parallel thereto, a pressure loader ( 22, 23, 39, 55, 59 ) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater ( 32, 47, 49, 50, 51, 52, 53 ) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes ( 2 a ) on its face.
1. A component mounting method for mounting a component having a plurality of bump electrodes on one face thereof onto leads of a mounting object, comprising:
holding with a mounting head a rear face of the component, the rear face being opposite to the face having the bump electrodes;
aligning the component with the mounting object disposed on a supporting base, and contacting the individual bump electrodes of the component to the individual leads of the mounting object; and
applying a pressure load and thermal energy to the rear face of the component while providing ultrasonic vibration, a vibrating direction of which is substantially parallel to the rear face,
the thermal energy being applied to the rear face of the component by a heater provided in the mounting head; and
wherein the rear face of the component is held by a working face of an oscillator that is configured such that vibration provided to an end face thereof causes vibration substantially parallel to the working face and such that a node of an oscillation mode is formed on an axis perpendicular to the working face;
wherein the oscillator forms part of the mounting head;
and wherein the pressure load is applied to the node of the oscillator.
2. The component mounting method according to claim 1 , wherein the pressure load is applied to the rear face of the component from a position immediately thereabove in a direction perpendicular thereto.
3. A component mounting method according to claim 1 or 2 , wherein an element of the ultrasonic vibration perpendicular to the rear face of the component is less than 10% of an element of the ultrasonic vibration parallel to the rear face.
4. A component mounting method according to claim 1 or 2 , wherein the pressure load is a product of the number of the bump electrodes and a unit load in a range of 30–200 g per bump electrode of the component.
5. A component mounting method according to claim 1 or 2 , wherein the component has 50 or more bump electrodes.
6. A component mounting method for mourning a component having a plurality of bump electrodes on one face thereof onto leads of a mounting object, comprising:
holding with a mounting head a rear face of the component, the rear face being opposite to the face having the bump electrodes;
aligning the component with the mounting object disposed on a supporting base, and contacting the individual bump electrodes of the component to the individual leads of the mounting object; and
applying a pressure load and thermal energy to the rear face of the component while providing ultrasonic vibration, a vibrating direction of which is substantially parallel to the rear face,
the thermal energy being applied to the rear face of the component by a heater provided in the mounting head;
wherein an element of the ultrasonic vibration perpendicular to the rear face of the component is less than 10% of an element of the ultrasonic vibration parallel to the rear face.
7. A component mounting method for mounting a component having a plurality of bump electrodes on one face thereof onto leads of a mounting object, comprising:
holding with a mounting head a rear face of the component, the rear face being opposite to the face having the bump electrodes;
aligning the component with the mounting object disposed on a supporting base, and contacting the individual bump electrodes of the component to the individual leads of the mounting object; and
applying a pressure load and thermal energy to the rear face of the component while providing ultrasonic vibration, a vibrating direction of which is substantially parallel to the rear face,
the thermal energy being applied to the rear face of the component by a heater provided in the mounting head;
wherein the pressure load is a product of the number of the bump electrodes and a unit load in a range of 30–200 g per bump electrode of the component.