Patent Assignment
Reel/Frame 015907/0578
Assignment of Assignor's Interest
Recorded: 2004-10-20
Pages: 2
Assignor
LIU, SHENG-TSUNG
Executed: 2004-08-09
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
NO. 26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, R.O.C., TAIWAN
Covered Property
(1)
Prevention of Contamination on Bonding Pads of Wafer During Smt