Patent Assignment
Reel/Frame 015934/0589
Assignment of Assignor's Interest
Recorded: 2004-10-26
Pages: 2
Assignee
TOSHIBA AMERICA ELECTRONICS COMPONENTS, INC.
9775 TOLEDO WAY, IRVINE, CALIFORNIA, 92618-1811
Covered Property
(1)
Method and System for a Pad Structure for Use with a Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.