Patent Assignment
Reel/Frame 016384/0314
Assignment of Assignor's Interest
Recorded: 2005-06-22
Pages: 2
Assignor
TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.
Executed: 2005-05-17
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1 SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method and System for a Pad Structure for Use with a Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.