IP Library Assignment 016030/0074
Patent Assignment
Reel/Frame 016030/0074

Assignment of Assignor's Interest

Recorded: 2004-11-24 Pages: 3
Assignors
KAWANO, MASAYA
Executed: 2004-11-10
MATSUI, SATOSHI
Executed: 2004-11-10
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Offset-Bonded, Multi-Chip Semiconductor Device
Patent: 7,145,247 →
Application: 10/995,491 →
Publication: US 2005/0121802
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0840 →