Patent Assignment
Reel/Frame 016073/0559
Assignment of Assignor's Interest
Recorded: 2004-12-14
Pages: 5
Assignors
KOBRINSKY, MAURO J.
Executed: 2004-12-01
RAMANATHAN, SHRIRAM
Executed: 2004-11-30
LIST, R. SCOTT
Executed: 2004-10-21
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Wafer Bondng with Highly Compliant Plate Having Filler Material Enclosed in Hollow Core.
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.