Patent Assignment
Reel/Frame 016112/0404
Assignment of Assignor's Interest
Recorded: 2004-12-20
Pages: 2
Assignee
SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
16-1 ONOGAWA, TSUKUBA-SHI, IBARAKI, 305-8569, JAPAN
Covered Property
(1)
Multilayered wiring structure, method of forming buried wiring, semiconductor device, method of manufacturing semiconductor device, semiconductor mounted device, and method of manufacturing semiconductor mounted device
Application:
11/014,883 →
Publication:
US 2005/0170641
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.