Patent Assignment
Reel/Frame 016130/0601
Assignment of Assignor's Interest
Recorded: 2004-12-22
Pages: 3
Assignor
KIM, JUNG GEUN
Executed: 2004-11-25
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUP, ICHON-SHI, KYUNGKI-DO, Q467-860, KOREA, REPUBLIC OF
Covered Property
(1)
Method of forming dielectric layer in semiconductor device
Application:
11/022,460 →
Publication:
US 2006/0079097
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.