Patent Assignment
Reel/Frame 016133/0011
Assignment of Assignor's Interest
Recorded: 2004-12-30
Pages: 2
Assignor
JUNG, BYUNG-HYUN
Executed: 2004-12-23
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10, DAECHI-DONG, KANGNAM-KU, SEOUL, 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Method for forming copper wiring of semiconductor device
Application:
11/026,927 →
Publication:
US 2005/0140012
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 8, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017749/0335 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017749 Frame 0335. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.".
Jun 21, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017821/0670 →