IP Library Assignment 016144/0071
Patent Assignment
Reel/Frame 016144/0071

Assignment of Assignor's Interest

Recorded: 2004-12-29 Pages: 3
Assignor
PARK, HYUK
Executed: 2004-12-23
Assignee
DONGBUANAM SEMICONDUCTOR, INC., A KOREAN CORP.
891-10 DAECHI-DONG, KANGNAM-KU, SEOUL 135-523, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Devices and Methods for Fabricating the Same Including Forming an Amorphous Region in an Interface Between a Device Isolation Layer and a Source/Drain Diffusion Layer
Patent: 7,399,669 →
Application: 11/027,362 →
Publication: US 2005/0153529
Related Assignments (8)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 22, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017654/0078 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017654 Frame 0078. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.". Jun 22, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017829/0911 →
Assignment of Assignor's Interest Oct 15, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034009/0157 →
Corrective Assignment to Correct Remove Patent No. 878209 from Exhibit B Previously Recorded at Reel: 034009 Frame: 0157. Assignor(S) Hereby Confirms the Assignment. Oct 24, 2014
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 034087/0097 →
Assignment of Assignor's Interest Feb 23, 2017
From: DONGBU HITEK, CO., LTD.
To: INPHI CORPORATION
Reel/Frame 041363/0853 →
Assignment of Assignor's Interest Jun 23, 2021
From: INPHI CORPORATION
To: MARVELL TECHNOLOGY CAYMAN I
Reel/Frame 056649/0823 →
Assignment of Assignor's Interest Jun 25, 2021
From: MARVELL TECHNOLOGY CAYMAN I
To: CAVIUM INTERNATIONAL
Reel/Frame 057279/0519 →
Assignment of Assignor's Interest Aug 27, 2021
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE LTD.
Reel/Frame 057336/0873 →