Patent Assignment
Reel/Frame 016152/0026
Assignment of Assignor's Interest
Recorded: 2004-12-29
Pages: 2
Assignor
KANG, BYOUNG YOUNG
Executed: 2004-12-21
Assignee
DONGBUANAM SEMICONDUCTOR, INC.
891-10 DAECHI-DONG, KANGNAM-KU, SEOUL 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Packages and Methods for Fabricating the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 22, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017654/0078 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017654 Frame 0078. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.".
Jun 22, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017829/0911 →