IP Library Assignment 016179/0349
Patent Assignment
Reel/Frame 016179/0349

Assignment of Assignor's Interest

Recorded: 2005-01-07 Pages: 2
Assignor
MEHROTRA, VIVEK
Executed: 2005-01-05
Assignee
ROCKWELL SCIENTIFIC LICENSING, LLC
P.O. BOX 1085, MAIL CODE A5, THOUSAND OAKS, CALIFORNIA, 91358-0085
Covered Property (1)
High Temperature, Stable Sic Device Interconnects and Packages Having Low Thermal Resistance
Patent: 7,390,735 →
Application: 11/031,435 →
Publication: US 2006/0151871
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Dec 5, 2006
From: ROCKWELL SCIENTIFIC LICENSING, LLC
To: TELEDYNE LICENSING, LLC
Reel/Frame 018583/0159 →
Confirmatory License Dec 1, 2008
From: ROCKWELL SCIENTIFIC COMPANY, LLC
To: UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE, THE
Reel/Frame 021912/0425 →
Confirmatory Assignment Jan 16, 2009
From: MEHROTRA, VIVEK
To: TELEDYNE LICENSING, LLC
Reel/Frame 022117/0262 →
Assignment of Assignor's Interest Mar 13, 2009
From: TELEDYNE LICENSING, LLC
To: ASTRIPHEY APPLICATIONS, L.L.C.
Reel/Frame 022392/0135 →
Merger Jan 13, 2016
From: ASTRIPHEY APPLICATIONS L.L.C.
To: CALLAHAN CELLULAR L.L.C.
Reel/Frame 037509/0695 →