Patent Assignment
Reel/Frame 022117/0262
Confirmatory Assignment
Recorded: 2009-01-16
Pages: 3
Assignor
MEHROTRA, VIVEK
Executed: 2009-01-14
Assignee
TELEDYNE LICENSING, LLC
1049 CAMINO DOS RIOS, THOUSAND OAKS, CALIFORNIA, 91360
Covered Property
(1)
High Temperature, Stable Sic Device Interconnects and Packages Having Low Thermal Resistance
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 7, 2005
From: MEHROTRA, VIVEK
To: ROCKWELL SCIENTIFIC LICENSING, LLC
Reel/Frame 016179/0349 →
Change of Name
Dec 5, 2006
From: ROCKWELL SCIENTIFIC LICENSING, LLC
To: TELEDYNE LICENSING, LLC
Reel/Frame 018583/0159 →
Confirmatory License
Dec 1, 2008
From: ROCKWELL SCIENTIFIC COMPANY, LLC
To: UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE, THE
Reel/Frame 021912/0425 →
Assignment of Assignor's Interest
Mar 13, 2009
From: TELEDYNE LICENSING, LLC
To: ASTRIPHEY APPLICATIONS, L.L.C.
Reel/Frame 022392/0135 →
Merger
Jan 13, 2016
From: ASTRIPHEY APPLICATIONS L.L.C.
To: CALLAHAN CELLULAR L.L.C.
Reel/Frame 037509/0695 →