IP Library › Assignment 022392/0135
Patent Assignment
Reel/Frame 022392/0135

Assignment of Assignor's Interest

Recorded: 2009-03-13 Pages: 5
Assignor
TELEDYNE LICENSING, LLC
Executed: 2009-01-29
Assignee
ASTRIPHEY APPLICATIONS, L.L.C.
2711 CENTERVILLE RD., SUITE 400, WILMINGTON, DELAWARE, 19808
Covered Property (1)
High Temperature, Stable Sic Device Interconnects and Packages Having Low Thermal Resistance
Patent: 7,390,735 →
Application: 11/031,435 →
Publication: US 2006/0151871
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 7, 2005
From: MEHROTRA, VIVEK
To: ROCKWELL SCIENTIFIC LICENSING, LLC
Reel/Frame 016179/0349 →
Change of Name Dec 5, 2006
From: ROCKWELL SCIENTIFIC LICENSING, LLC
To: TELEDYNE LICENSING, LLC
Reel/Frame 018583/0159 →
Confirmatory License Dec 1, 2008
From: ROCKWELL SCIENTIFIC COMPANY, LLC
To: UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE, THE
Reel/Frame 021912/0425 →
Confirmatory Assignment Jan 16, 2009
From: MEHROTRA, VIVEK
To: TELEDYNE LICENSING, LLC
Reel/Frame 022117/0262 →
Merger Jan 13, 2016
From: ASTRIPHEY APPLICATIONS L.L.C.
To: CALLAHAN CELLULAR L.L.C.
Reel/Frame 037509/0695 →