Patent Assignment
Reel/Frame 016202/0747
Assignment of Assignor's Interest
Recorded: 2005-01-18
Pages: 4
Assignor
BACKHAUSS, HENNING
Executed: 2005-01-11
Assignee
LEICA MICROSYSTEMS SEMICONDUCTOR GMBH
ERNST-LEITZ-STRASSE 17-37, 35578 WETZLAR, GERMANY
Covered Property
(1)
Apparatus for wafer inspection
Application:
11/037,668 →
Publication:
US 2005/0122509
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 29, 2006
From: LEICA MICROSYSTEMS SEMICONDCTOR GMBH
To: VISTEC SEMICONDUCTOR SYSTEMS GMBH
Reel/Frame 017846/0823 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017846 Frame 0823. Assignor(S) Hereby Confirms the Change of Name
Jul 20, 2006
From: LEICA MICROSYSTEMS SEMICONDUCTOR GMBH
To: VISTEC SEMICONDUCTOR SYSTEMS GMBH
Reel/Frame 018026/0297 →
Change of Address
Jul 12, 2007
From: VISTEC SEMICONDUCTOR SYSTEMS GMBH
To: VISTEC SEMICONDUCTOR SYSTEMS GMBH
Reel/Frame 019541/0634 →