Patent Assignment
Reel/Frame 016275/0329
Assignment of Assignor's Interest
Recorded: 2005-05-25
Pages: 3
Assignor
LIM, WON-CHUL
Executed: 2005-03-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wire Bonding System and Method of Use