Patent Assignment
Reel/Frame 016305/0219
Assignment of Assignor's Interest
Recorded: 2004-07-30
Pages: 9
Assignor
LEE, JAE-SUK
Executed: 2004-07-22
Assignee
DONBU ELECTRONICS CO., LTD.
838, YEOKSAM 1-DONG, KANGNAM-KU, SEOUL 135-080, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Fabricating Metal Wiring and Semiconductor Device Having the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
May 31, 2005
From: DONGBU SEMICONDUCTOR INC.
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016593/0667 →
Corrective Assignment to Correct Assignee's Name Previously Recorded at Reel 016305 Frame 0219.
Sep 19, 2005
From: LEE, JAE-SUK
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 016995/0282 →
Change of Name
Jun 8, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017749/0335 →
Corrective Assignment to Correct the Assignor Previously Recorded on Reel 017749 Frame 0335. Assignor(S) Hereby Confirms the Assignor Should Be "Dongbuanam Semiconductor Inc.".
Jun 21, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017821/0670 →