IP Library Assignment 016312/0455
Patent Assignment
Reel/Frame 016312/0455

Assignment of Assignor's Interest

Recorded: 2005-02-23 Pages: 3
Assignors
KIM, JIN YOUNG
Executed: 2004-12-20
CHO, SUNG HEN
Executed: 2004-12-20
SONG, KI YONG
Executed: 2004-12-20
NOH, CHANG HO
Executed: 2004-12-20
HWANG, EUK CHE
Executed: 2004-12-20
Assignee
SAMSUNG CORNING CO., LTD.
472, SIN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO 443-732, KOREA, REPUBLIC OF
Covered Property (1)
Method for Forming Highly Conductive Metal Pattern on Flexible Substrate and Emi Filter Using Metal Pattern Formed by the Method
Patent: 7,494,926 →
Application: 11/014,703 →
Publication: US 2006/0019076
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Mar 10, 2008
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING CO., LTD.
Reel/Frame 020624/0240 →
Corrective Assignment to Correct the Assignee/Assignor Previously Recorded on Reel 020624 Frame 0240. Assignor(S) Hereby Confirms the Merger. May 16, 2008
From: SAMSUNG CORNING CO., LTD.
To: SAMSUNG CORNING PRECISION GLASS CO., LTD.
Reel/Frame 020956/0832 →
Change of Name Aug 6, 2010
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 024804/0238 →