Method for forming highly conductive metal pattern on flexible substrate and EMI filter using metal pattern formed by the method
View Patent ↗Disclosed herein is a method for forming a highly conductive metal pattern which comprises forming a metal pattern on a substrate by the use of a photocatalyst and a selective electroless or electroplating process, and transferring the metal pattern to a flexible plastic substrate. According to the method, a highly conductive metal pattern can be effectively formed on a flexible plastic substrate within a short time, compared to conventional formation methods. Further disclosed is an EMI filter comprising a metal pattern formed by the method. The EMI filter not only exhibits high performances, but also is advantageous in terms of low manufacturing costs and simple manufacturing process. Accordingly, the EMI filter can be applied to a variety of flat panel display devices, including PDPs and organic ELs.
1. A method for forming a highly conductive metal pattern on a flexible plastic substrate, comprising the steps of:
forming a latent pattern acting as a nucleus for crystal growth on a base substrate, and growing initial metal crystals on the latent pattern by plating to form a metal pattern;
transferring the metal pattern to a first adhesive-treated flexible plastic substrate; wherein the step of forming a metal pattern includes the sub-steps of:
coating a photocatalytic compound on the base substrate to form a photocatalytic film, wherein the photocatalytic compound is a Ti-containing organic compound forming a water-soluble polymer layer on the Ti-containing organic compound layer;
selectively exposing the photocatalytic film to light to form a latent pattern acting as a nucleus for crystal growth; and
growing metal crystals on the latent pattern by plating the latent pattern to form the metal pattern; and
growing additional metal crystals on the latent pattern to form another metal pattern for transfer to a second adhesive-treated flexible plastic substrate.
2. The method according to claim 1 , wherein the growing of the additional metal crystals comprises using the same photocatalytic film and the same substrate for growing the additional metal crystals as for use in growing the initial metal crystals.
3. The method according to claim 1 , wherein the plating of the third sub-step is performed by an electroless or electro-plating process, and the plating metal is selected from the group consisting of Ni, Cu, Ag, Au and alloys thereof.
4. The method according to claim 2 , wherein the plating of the third sub-step is performed by an electroless or electro-plating process, and the plating metal is selected from the group consisting of Ni, Cu, Ag, Au and alloys thereof.
5. An EMI filter comprising a metal pattern formed by the method according to claim 1 .
6. A flat panel display device comprising the EMI filter according to claim 5 .
7. The method according to claim 1 , wherein Ti-containing organic compound is selected from a group consisting of tetraisopropyl titanate, tetra-n-butyl titanate, tetrakis (2-ethylhexyl) titanate, and polybutyl titanate.
8. A method for forming a highly conductive metal pattern on a flexible plastic substrate, comprising the steps of:
forming a latent pattern acting as a nucleus for crystal growth on a base substrate, and growing initial metal crystals on the latent pattern by plating to form a metal pattern;
transferring the metal pattern to a first adhesive-treated flexible plastic substrate; wherein the step of forming a metal pattern includes the sub-steps of:
coating a photocatalytic compound on the base substrate to form a photocatalytic film, wherein the photocatalytic compound is a Ti-containing organic compound forming a water-soluble polymer layer on the Ti-containing organic compound layer;
selectively exposing the photocatalytic film to light to form a latent pattern acting as a nucleus for crystal growth; and
growing metal crystals on the latent pattern by plating the latent pattern to form the metal pattern;
growing additional metal crystals on the latent pattern to form another metal pattern for transfer to a second adhesive-treated flexible plastic substrate; and
treating the latent pattern acting as a nucleus for crystal growth with a metal salt solution to form a metal particle-deposited pattern thereon and completely remove the water-soluble polymer layer.
9. A method for forming a highly conductive metal pattern on a flexible plastic substrate, comprising the steps of:
forming a latent pattern acting as a nucleus for crystal growth on the substrate, and growing metal crystals on the latent pattern by plating to form a metal pattern;
transferring the metal pattern to an adhesive-treated flexible plastic substrate, wherein the step of forming a metal pattern includes the sub-steps of:
coating a photocatalytic compound on the substrate to form a photocatalytic film,
selectively exposing the photocatalytic film to light to form a latent pattern acting as a nucleus for crystal growth, and
growing metal crystals on the latent pattern by plating the latent pattern to form the metal pattern, and wherein the photocatalytic compound is a Ti-containing organic compound;
forming a water-soluble polymer layer on the Ti-containing organic compound layer; and
treating the latent pattern acting as a nucleus for crystal growth with a metal salt solution to form a metal particle-deposited pattern thereon and completely remove the water-soluble polymer layer, wherein the metal salt solution is a palladium salt solution, a silver salt solution, or a mixed solution thereof.
10. A method for forming a highly conductive metal pattern on a flexible plastic substrate, comprising the steps of:
forming a latent pattern acting as a nucleus for crystal growth on the substrate, and growing metal crystals on the latent pattern by plating to form a metal pattern;
transferring the metal pattern to an adhesive-treated flexible plastic substrate, wherein the step of forming a metal pattern includes the sub-steps of:
coating a photocatalytic compound on the substrate to form a photocatalytic film,
selectively exposing the photocatalytic film to light to form a latent pattern acting as a nucleus for crystal growth, and
growing metal crystals on the latent pattern by plating the latent pattern to form the metal pattern; and
returning the substrate on which the photocatalytic film remains after the transfer of the metal pattern to the adhesive-treated plastic substrate to the second sub-step.
11. A method for forming a highly conductive metal pattern on a flexible plastic substrate, comprising the steps of:
forming a latent pattern acting as a nucleus for crystal growth on the substrate, and growing metal crystals on the latent pattern by plating to form a metal pattern;
transferring the metal pattern to an adhesive-treated flexible plastic substrate, wherein the step of forming a metal pattern includes the sub-steps of:
coating a photocatalytic compound on the substrate to form a photocatalytic film;
selectively exposing the photocatalytic film to light to form a latent pattern acting as a nucleus for crystal growth, and
growing metal crystals on the latent pattern by plating the latent pattern to form the metal pattern, wherein the photocatalytic compound is a Ti-containing organic compound; and
returning the substrate on which the photocatalytic film remains after the transfer of the metal pattern to the adhesive-treated plastic substrate to the second sub-step.
12. A method for forming a highly conductive metal pattern on a flexible plastic substrate, comprising the steps of:
forming a latent pattern acting as a nucleus for crystal growth on the substrate, and growing metal crystals on the latent pattern by plating to form a metal pattern;
transferring the metal pattern to an adhesive-treated flexible plastic substrate, wherein the step of forming a metal pattern includes the sub-steps of:
coating a photocatalytic compound on the substrate to form a photocatalytic film;
selectively exposing the photocatalytic film to light to form a latent pattern acting as a nucleus for crystal growth; and
growing metal crystals on the latent pattern by plating the latent pattern to form the metal pattern, wherein the photocatalytic compound is a Ti-containing organic compound, wherein the photocatalytic compound is a Ti-containing organic compound; and forming a water-soluble polymer layer on the Ti-containing organic compound layer; and
adding a photosensitizer selected from the group consisting of water-soluble colorants, organic acids, organic acid salts and organic amines to a resin for the water-soluble polymer layer.
13. A method for recycling photocatalytic film on a substrate used in forming a metal pattern on a plastic substrate, comprising:
forming a photocatalytic film on a substrate;
forming a water-soluble polymer layer on the photocatalytic film;
patterning the water-soluble polymer layer;
depositing metal particles on the photocatalytic layer between patterned portions of the water-soluble polymer layer;
plating the metal particles to form a metal pattern;
transferring the metal pattern onto a plastic substrate; and
recycling the photocatalytic film remaining on the substrate.
14. The method according to claim 13 , wherein the recycling the photocatalytic film remaining on the substrate comprises:
providing the photocatalytic film remaining on the substrate;
forming a water-soluble polymer layer on the photocatalytic film;
patterning the water-soluble polymer layer;
depositing metal particles on the photocatalytic layer between patterned portions of the water-soluble polymer layer;
removing the water-soluble polymer layer;
plating the metal particles to form a metal pattern; and
transferring the metal pattern onto a plastic substrate.
15. The method according to claim 13 , wherein the recycling the photocatalytic film remaining on the substrate comprises re-using the same photocatalytic film and the same substrate for forming an additional metal pattern on a plastic substrate.
16. The method according to claim 15 , wherein plating the metal particles to form a metal pattern comprises dipping the substrate into a plating solution of a metal salt, a complexing agent, a pH-adjusting agent, a pH buffer, and a modifying agent.
17. The method according to claim 13 , wherein the photocatalytic film is a Ti-containing organic film.
18. The method according to claim 17 , wherein Ti-containing organic compound is selected from a group consisting of tetraisopropyl titanate, tetra-n-butyl titanate, tetrakis (2-ethylhexyl) titanate, and polybutyl titanate, and wherein the method further includes forming a water-soluble polymer layer on the Ti-containing organic compound layer.