Patent Assignment
Reel/Frame 016316/0395
Assignment of Assignor's Interest
Recorded: 2005-01-31
Pages: 2
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Metal Foil with Resin and Metal-Clad Laminate, and Printed Wiring Board Using the Same and Method for Production Thereof