Patent Assignment
Reel/Frame 016358/0078
Assignment of Assignor's Interest
Recorded: 2005-03-10
Pages: 3
Assignee
DALSA SEMICONDUCTOR INC.
605 MCMURRAY ROAD, WATERLOO ON, N2V 2E9, CANADA
Covered Property
(1)
Hermetic Wafer-Level Packaging for Mems Devices with Low-Temperature Metallurgy
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.