Patent Assignment
Reel/Frame 016374/0479
Assignment of Assignor's Interest
Recorded: 2005-03-08
Pages: 2
Assignors
SHIH, CHIEN-HSUEH
Executed: 2005-03-01
TSAI, MINGHSING
Executed: 2005-03-01
SU, HUNG-WEN
Executed: 2005-03-01
SHUE, SHAU-LIN
Executed: 2005-03-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, ROC 300-77, TAIWAN
Covered Property
(1)
Copper Interconnection with Conductive Polymer Layer and Method of Forming the Same