Copper interconnection with conductive polymer layer and method of forming the same
View Patent ↗A conductive polymer between two metallic layers acts a glue layer, a barrier layer or an activation seed layer. The conductive polymer layer is employed to encapsulate a copper interconnection structure to prevent copper diffusion into any overlying layers and improve adhesive characteristics between the copper and any overlying layers.
1. A semiconductor device, comprising:
a substrate;
a first dielectric layer over the substrate, the first dielectric layer having an opening on a first upper surface;
a copper-based metallic layer filling said opening of said first dielectric layer;
a first conductive polymer layer completely covering and in contact with the upper surface of said copper-based metallic layer, the first conductive polymer layer having a second upper surface located further from the substrate than the first upper surface; and
a second dielectric layer over both the first dielectric layer and the first conductive polymer layer and in physical contact with at least a portion of the first dielectric layer.
2. The semiconductor device of claim 1 , wherein said first conductive polymer layer is an organic material including electroactive conjugated conducting polymers comprising polyaniline, polypyrrole, polythiophene, polyethylenevinylene or poly-4-vinyl pyridine.
3. The semiconductor device of claim 1 , further comprising a metallic layer located over said first conductive polymer layer.
4. The semiconductor device of claim 3 , wherein said metallic layer comprises copper or copper-based alloys.
5. The semiconductor device of claim 3 , wherein said metallic layer comprises Co, Ni, Co-based alloys or Ni-based alloys.
6. The semiconductor device of claim 1 , wherein said first dielectric layer has a dielectric constant less than about 3.9.
7. The semiconductor device of claim 1 , further comprising a diffusion barrier layer lining said opening of said first dielectric layer, wherein said diffusion barrier layer is inserted between said copper-based metallic layer and said first dielectric layer.
8. The semiconductor device of claim 7 , wherein said diffusion barrier layer comprises Ta, TaN, Ti, TiN or combinations thereof.
9. The semiconductor device of claim 7 , wherein said diffusion barrier layer comprises Co, Ni, Pt, Ru, W, Pd, or Au.
10. The semiconductor device of claim 1 , further comprising a second conductive polymer layer lining sidewalls of said opening, wherein said second conductive polymer layer is inserted between said copper-based metallic layer and said first dielectric layer.
11. The semiconductor device of claim 10 , wherein said second conductive polymer layer is connected to said first conductive polymer layer.
12. The semiconductor device of claim 10 , further comprising a diffusion barrier layer lining said opening of said first dielectric layer, wherein said diffusion barrier layer is inserted between said second conductive polymer layer and said copper-based metallic layer.
13. The semiconductor device of claim 12 , wherein said diffusion barrier layer comprises Ta, TaN, Ti, TiN or combinations thereof.
14. The semiconductor device of claim 12 , wherein said diffusion barrier layer comprises Co, Ni, Pt, Ru, W, Pd, or Au.
15. The semiconductor device of claim 10 , wherein said second conductive polymer layer is an organic material including electroactive conjugated conducting polymers comprising polyaniline, polypyrrole, polythiophene, polyethylenevinylene or poly-4-vinyl pyridine.
16. The semiconductor device of claim 1 , wherein the upper surface of said copper-based metallic layer is substantially planar with said first dielectric layer.
17. The semiconductor device of claim 1 , wherein said first conductive polymer layer is substantially planar with said first dielectric layer.
18. A semiconductor device, comprising:
a copper-based metallic layer embedded in a dielectric layer and having an upper surface;
an aluminum-based metallic pad located over said copper-based metallic layer; and
a conductive polymer layer located between and separating the copper-based metallic layer and the aluminum-based metallic pad, the conductive polymer layer being in contact with the upper surface of said copper-based metallic layer but not substantially extending beyond the copper-based metallic layer in a direction substantially parallel to the upper surface.
19. The semiconductor device of claim 18 , wherein said conductive polymer layer is an organic material including electroactive conjugated conducting polymers comprising polyaniline, polypyrrole, polythiophene, polyethylenevinylene or poly-4-vinyl pyridine.
20. The semiconductor device of claim 18 , further comprising a passivation layer located on said dielectric layer and having an opening that defines the upper surface of said copper-based metallic layer.
21. The semiconductor device of claim 20 , further comprising a diffusion barrier layer lining said opening of said passivation layer, wherein said diffusion barrier layer is inserted between said aluminum-based metallic pad and said conductive polymer layer.
22. The semiconductor device of claim 21 , wherein said diffusion barrier layer comprises Ta, TaN, Ti, TiN or combinations thereof.
23. The semiconductor device of claim 18 , wherein said dielectric layer has a dielectric constant less than about 3.9.