Patent Assignment
Reel/Frame 016431/0969
Assignment of Assignor's Interest
Recorded: 2005-06-28
Pages: 10
Assignors
KIM, DAE HYEONG
Executed: 2005-05-17
HONG, SEOK MIN
Executed: 2005-05-17
JEON, JAE HYUN
Executed: 2005-05-17
KIM, HO SEONG
Executed: 2005-05-17
PARK, HYUN SOO
Executed: 2005-05-17
PAIK, UN GYU
Executed: 2005-05-06
PARK, JAE GUN
Executed: 2005-05-06
KIM, YONG KUK
Executed: 2005-05-17
Assignees
K.C. TECH CO., LTD.
268-1, GERUK-RI, MIYANG-MYEON, ANSEONG-SI, GYEONGGI-DO, 456-840, KOREA, REPUBLIC OF
IUCF-HYU
17, HAENGDANG-DONG, SUNGDONG-GU, SEOUL, 133-791, KOREA, REPUBLIC OF
Covered Property
(1)
Slurry for Cmp and Method of Polishing Substrate Using Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.