Patent Assignment
Reel/Frame 045427/0333
Assignment of Assignor's Interest
Recorded: 2018-04-03
Pages: 4
Assignor
KC CO., LTD.
Executed: 2018-03-21
Assignee
KCTECH CO., LTD.
30, JE2GONGDAN 3-GIL, MIYANG-MYEON, ANSEONG-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Properties
(5)
Polishing Slurry, Method of Producing Same, and Method of Polishing Substrate
Slurry for Cmp and Method of Polishing Substrate Using Same
Cmp Slurry, Preparation Method Thereof and Method of Polishing Substrate Using the Same
Polishing Slurry, Method of Producing Same, and Method of Polishing Substrate
Polishing Slurry Composition
Application:
15/325,095 →
Publication:
US 2017/0183537
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 24, 2005
From: KIM, DAE HYUNG; HONG, SEOK MIN; JEON, JAE HYUN; KIM, HO SEONG
To: K.C. TECH CO., LTD.; IUCF-HYU
Reel/Frame 016273/0957 →
Assignment of Assignor's Interest
Jun 28, 2005
From: KIM, DAE HYEONG; HONG, SEOK MIN; JEON, JAE HYUN; KIM, HO SEONG
To: K.C. TECH CO., LTD.; IUCF-HYU
Reel/Frame 016431/0969 →
Assignment of Assignor's Interest
Nov 8, 2006
From: SUH, MYOUNG WON; KIM, DAE HYEONG
To: K. C. TECH CO., LTD
Reel/Frame 018497/0723 →
Assignment of Assignor's Interest
Nov 8, 2006
From: PAIK, UN GYU; PARK, JEA GUN; KIM, SANG KYUN; KIM, YE HWAN
To: IUCF-HYU
Reel/Frame 018497/0726 →
Assignment of Assignor's Interest
Jan 10, 2017
From: YOON, JOO HYOUNG; HONG, SEUNG CHUL; YOON, YOUNG HO; PAIK, UN GYU
To: K.C.TECH CO., LTD; IUCF-HYU(INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
Reel/Frame 040910/0836 →
Change of Name
Mar 29, 2018
From: K.C. TECH CO., LTD.
To: KC CO., LTD.
Reel/Frame 045390/0019 →