Patent Assignment
Reel/Frame 018497/0726
Assignment of Assignor's Interest
Recorded: 2006-11-08
Pages: 5
Assignors
PAIK, UN GYU
Executed: 2006-08-17
PARK, JEA GUN
Executed: 2006-08-21
KIM, SANG KYUN
Executed: 2006-08-17
KIM, YE HWAN
Executed: 2006-08-17
Assignee
IUCF-HYU
17, HAENGDANG-DONG, SUNGDONG-GU, SEOUL, 133-791, KOREA, REPUBLIC OF
Covered Property
(1)
Cmp Slurry, Preparation Method Thereof and Method of Polishing Substrate Using the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 8, 2006
From: SUH, MYOUNG WON; KIM, DAE HYEONG
To: K. C. TECH CO., LTD
Reel/Frame 018497/0723 →
Change of Name
Mar 29, 2018
From: K.C. TECH CO., LTD.
To: KC CO., LTD.
Reel/Frame 045390/0019 →
Assignment of Assignor's Interest
Apr 3, 2018
From: KC CO., LTD.
To: KCTECH CO., LTD.
Reel/Frame 045427/0333 →