IP Library › Assignment 018497/0723
Patent Assignment
Reel/Frame 018497/0723

Assignment of Assignor's Interest

Recorded: 2006-11-08 Pages: 3
Assignors
SUH, MYOUNG WON
Executed: 2006-08-11
KIM, DAE HYEONG
Executed: 2006-08-11
Assignee
K. C. TECH CO., LTD
268-1, GERUK-RI, MIYANG-MYEON, ANSEONG-SI, GYEONGGI-DO, 456-840, KOREA, REPUBLIC OF
Covered Property (1)
Cmp Slurry, Preparation Method Thereof and Method of Polishing Substrate Using the Same
Patent: 8,062,547 →
Application: 11/421,965 →
Publication: US 2007/0075291
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 8, 2006
From: PAIK, UN GYU; PARK, JEA GUN; KIM, SANG KYUN; KIM, YE HWAN
To: IUCF-HYU
Reel/Frame 018497/0726 →
Change of Name Mar 29, 2018
From: K.C. TECH CO., LTD.
To: KC CO., LTD.
Reel/Frame 045390/0019 →
Assignment of Assignor's Interest Apr 3, 2018
From: KC CO., LTD.
To: KCTECH CO., LTD.
Reel/Frame 045427/0333 →