IP Library › Assignment 016469/0009
Patent Assignment
Reel/Frame 016469/0009

Assignment of Assignor's Interest

Recorded: 2005-07-05 Pages: 2
Assignors
GAYNES, MICHAEL ANTHONY
Executed: 2005-05-09
HINGE, KATHLEEN CONLON
Executed: 2005-05-02
KNICKERBOCKER, JOHN ULRICH
Executed: 2005-05-05
Assignee
Covered Property (1)
Apparatus and Methods for Constructing Balanced Chip Packages to Reduce Thermally Induced Mechanical Strain
Patent: 7,504,718 →
Application: 11/125,499 →
Publication: US 2006/0255442
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Release of Security Interest May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →